Our Center participated in various round tables included in the scientific program and in different meetings to promote technological collaboration and develop projects with other businesses and entities
Last February 14 and 15, the seventh edition of the Foro Transfiere, the European Forum for Science, Technology and Innovation, was celebrated. More than 4,000 participants from 1,500 different companies, public entities, and research and technology centers attended with the objective of establishing relations and stimulating collaborations in R+D and overall innovation in different industrial sectors.
Our Center once again returned to attend this important scientific and technological event. Specifically, our Center participated in various round table discussions in the scientific program and in different meetings to foster collaboration with other businesses and entities and establish possible business agreements.
Our head of the Division of Materials and Processes, Fernando Lasagni, participated in a round table discussion about Functional Printing and Additive Manufacturing with other high-profile speakers like the Director of the Technology Platform 3NEO, Carlos Ruiz de León, and other business leaders from CEIT-IK4, PACKNET (the Spanish Technology Platform for Packaging), ITENE (the Spanish Technology Institute of Packaging, Transportation, and Logistics), MANU-KET (the Spanish Technology Platform for Advanced Manufacturing), REGEMAT 3D, AIJU (Spanish Technology Institute for Children’s Leisure Products), the University of Navarre and the Spanish Technology Platform, FOTONICA 21.
Additionally, we were present in the Printing Innovation Zone, a qualified zone created by the Spanish Technology Aerospace Platform, where we also made a presentation about CATEC and Additive Manufacturing.
